The_King Posted December 13, 2021 Share Posted December 13, 2021 KUALA LUMPUR (BLOOMBERG) - Intel Corp will invest RM30 billion (S$9.7 billion) to expand its manufacturing capabilities in advanced semiconductor packaging technology in Penang, Malaysia, according to a press invitation on Monday (Dec 13). The chipmaker is scheduled to hold a press conference on Wednesday at the Kuala Lumpur International Airport on the investment. Intel chief executive Patrick Paul Gelsinger, Malaysia's Trade Minister Azmin Ali and Malaysian Investment Development Authority CEO Arham Abdul Rahman will be present. The addition of advanced packaging capabilities to Intel's operations in Malaysia will strengthen its supporting activities and its global service centre, according to the invite. The investment will position Malaysia as one of the key hubs for manufacturing and shared services. 1 1 Link to comment Share on other sites More sharing options...
aaur4man Posted December 14, 2021 Share Posted December 14, 2021 Link to comment Share on other sites More sharing options...
socrates469bc Posted December 14, 2021 Share Posted December 14, 2021 jin low tech. if want to invest, build fab lai, intel. confirm is see bolehsia no up. wahahahahahaha Link to comment Share on other sites More sharing options...
Recommended Posts
Create an account or sign in to comment
You need to be a member in order to leave a comment
Create an account
Sign up for a new account in our community. It's easy!
Register a new accountSign in
Already have an account? Sign in here.
Sign In Now